High-Performance Rheology Solutions

Organoclay for Adhesive & Sealant Superior Bonding Performance

Professional-grade organoclay rheology modifiers designed specifically for adhesive and sealant applications. Enhanced bonding strength, application control, and superior thixotropic properties.

25°C-150°C
Working Temperature
Superior
Bonding Strength
Excellent
Thixotropic Control
Multiple
Application Types

Adhesive & Sealant Applications

Our organoclay products provide exceptional rheological control for various adhesive and sealant formulations

Structural Adhesives

High-strength bonding for construction and industrial applications

Polyurethane Sealants

Weather-resistant sealing for construction and automotive

Hot Melt Adhesives

Temperature-stable bonding for packaging and assembly

Specialty Bonding

Custom formulations for demanding industrial applications

Our Product Range

Discover our comprehensive range of organoclay products specifically formulated for adhesive and sealant applications

Need Technical Support?

Our expert technical team is ready to help you select the right organoclay product for your specific adhesive and sealant applications.